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description these high gain series couplers use a light emitting diode and an integrated high gain photodetector to provide extremely high current transfer ratio between input and output. separate pins for the photodiode and output stage result in lvttl compatible saturation voltages and high speed operation. where desired, the v cc and v o terminals may be tied together to achieve conventional photo- agilent hcpl-270l/ 070l/273l/073l low input current high gain lvttl/lvcmos compatible 3.3 v optocouplers data sheet features low power consumption high current transfer ratio low input current requirements 0.5 ma lvttl/lvcmos compatible output performance guaranteed over temperature 0?c to +70?c base access allows gain bandwidth adjustment high output current ?60 ma safety approval, ul, iec/en/din en 60747-5-2, csa applications ground isolate most logic families ?lvttl/lvcmos low input current line receiver high voltage insulation eia rs-232c line receiver telephone ring detector v ac line voltage status indicator ?low input power dissipation low power systems ?ground isolation functional diagram a 0.1 f bypass capacitor connected between pins 8 and 5 is recommended. caution: it is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by esd. darlington operation. a base access terminal allows a gain bandwidth adjustment to be made. these optocouplers are for use in lvttl/lvcmos or other low power applications. a 400% minimum current transfer ratio is guaranteed over 0 to +70?c operating range for only 0.5 ma of led current. 7 1 2 3 4 5 6 8 nc anode cathode nc v cc v o gnd truth table led on off v o low high v b v o2 v o1 v cc gnd anode 1 cathode 1 cathode 2 anode 2 7 5 6 8 2 3 4 1 shield hcpl-270l/070l hcpl-273l/073l
2 selection guide 8-pin dip (300 mil) small outline so-8 single channel dual channel single channel dual channel minimum input package hcpl- package hcpl- package hcpl- package hcpl- on current (i f ) minimum ctr 270l 273l 070l 073l 0.5 ma 400% ordering information specify part number followed by option number (if desired). example: hcpl-270l # xxxx 060 = iec/en/din en 60747-5-2 option 500 = tape and reel packaging option xxxe = lead free option option data sheets available. contact your agilent sales representative or authorized distributor for information. schematic the HCPL-070L and hcpl-073l are surface mount devices packaged in an industry standard soic-8 footprint. the soic-8 does not require "through holes" in a pcb. this package occupies approximately one-third the footprint area of the standard dual-in-line package. the lead profile is designed to be compatible with standard surface mount processes. hcpl-270l/HCPL-070L hcpl-273l/hcpl-073l i f 8 v cc 2 3 i cc v f anode cathode + v b i b 6 5 gnd v o i o 7 shield remarks: the notation ??is used for existing products, while (new) products launched since 15th july 2001 and lead free option will use ? i f2 6 5 gnd 3 4 v o2 v f2 i o2 + i f1 8 7 v cc 1 2 v o1 i cc v f1 i o1 + shield use of a 0.1 f bypass capacitor connected between pins 5 and 8 is recommended
3 package outline drawings 8-pin dip package 1.080 0.320 (0.043 0.013) 2.54 0.25 (0.100 0.010) 0.51 (0.020) min. 0.65 (0.025) max. 4.70 (0.185) max. 2.92 (0.115) min. 5 typ. 0.254 + 0.076 - 0.051 (0.010 + 0.003) - 0.002) 7.62 0.25 (0.300 0.010) 6.35 0.25 (0.250 0.010) 9.65 0.25 (0.380 0.010) 1.78 (0.070) max. 1.19 (0.047) max. a xxxxz yyww date code dimensions in millimeters and (inches). 5 6 7 8 4 3 2 1 option code* ul recognition ur type number * marking code letter for option numbers "l" = option 020 "v" = option 060 option numbers 300 and 500 not marked. note: floating lead protrusion is 0.25 mm (10 mils) max. 3.56 0.13 (0.140 0.005) small outline so-8 package xxxv yww 8765 4 3 2 1 5.994 0.203 (0.236 0.008) 3.937 0.127 (0.155 0.005) 0.406 0.076 (0.016 0.003) 1.270 (0.050) bsc 5.080 0.127 (0.200 0.005) 3.175 0.127 (0.125 0.005) 1.524 (0.060) 45 x 0.432 (0.017) 0.228 0.025 (0.009 0.001) type number (last 3 digits) date code 0.305 (0.012) min. total package length (inclusive of mold flash) 5.207 0.254 (0.205 0.010) dimensions in millimeters (inches). lead coplanarity = 0.10 mm (0.004 inches) max. option number 500 not marked. note: floating lead protrusion is 0.15 mm (6 mils) max. 0.203 0.102 (0.008 0.004) 7 pin one 0 ~ 7 * * option 060 code 7.49 (0.295) 1.9 (0.075) 0.64 (0.025) land pattern recommendation
4 solder reflow temperature profile regulatory information the devices contained in this data sheet have been approved by the following organizations: ul approval under ul 1577, component recognition program, file e55361. csa approval under csa component acceptance notice #5, file ca 88324. iec/en/din en 60747-5-2 approved under iec 60747-5-2:1997 + a1:2002 en 60747-5-2:2001 + a1:2002 din en 60747-5-2 (vde 0884 teil 2):2003-01 (option 060 only) recommended pb-free ir profile 0 time (seconds) temperature ( c) 200 100 50 150 100 200 250 300 0 30 sec. 50 sec. 30 sec. 160 c 140 c 150 c peak temp. 245 c peak temp. 240 c peak temp. 230 c soldering time 200 c preheating time 150 c, 90 + 30 sec. 2.5 c 0.5 c/sec. 3 c + 1 c/ 0.5 c tight typical loose room temperature preheating rate 3 c + 1 c/ 0.5 c/sec. reflow heating rate 2.5 c 0.5 c/sec. 217 c ramp-down 6 c/sec. max. ramp-up 3 c/sec. max. 150 - 200 c 260 +0/-5 c t 25 c to peak 60 to 150 sec. 20-40 sec. time within 5 c of actual peak temperature t p t s preheat 60 to 180 sec. t l t l t smax t smin 25 t p time temperature notes: the time from 25 c to peak temperature = 8 minutes max. t smax = 200 c, t smin = 150 c
5 insulation and safety related specifications 8-pin dip (300 mil) so-8 parameter symbol v alue value units conditions minimum external air l (101) 7.1 4.9 mm measured from input terminals to output gap (external clearance) terminals, shortest distance through air. minimum external tracking l (102) 7.4 4.8 mm measured from input terminals to output (external creepage) terminals, shortest distance path along body. minimum internal plastic 0.08 0.08 mm through insulation distance, conductor to gap (internal clearance) conductor, usually the direct distance between the photoemitter and photodetector inside the optocoupler cavity. tracking resistance cti 200 200 volts din iec 112/vde 0303 part 1. (comparative tracking index) isolation group iiia iiia material group (din vde 0110, 1/89, table 1). iec/en/din en 60747-5-2 insulation related characteristics 8-pin dip description symbol (300 mil) so-8 units installation classification per din vde 0110/1.89, table 1 for rated mains voltage 150 v rms i-iv for rated mains voltage 300 v rms i-iv i-iii for rated mains voltage 600 v rms i-iii i-ii climatic classification 55/100/21 55/100/21 pollution degree (din vde 0110/1.89) 2 2 maximum working insulation voltage v iorm 630 566 v peak input to output test voltage, method b* v pr = 1.875 x v iorm , 100% production test with t p = 1 sec, v pr 1181 1063 v peak partial discharge < 5 pc input to output test voltage, method a* v pr = 1.5 x v iorm , type and sample test, v pr 945 849 v peak t p = 60 sec, partial discharge < 5 pc highest allowable overvoltage* v iotm 6000 4000 v peak (transient overvoltage, t ini = 10 sec) safety limiting values (maximum values allowed in the event of a failure, also see figure 11, thermal derating curve.) case temperature t s 175 150 ?c current (input current i f , p s = 0) i s,input 400 150 ma output power p s,output 600 600 mw insulation resistance at t s , v io = 500 v r s 10 9 10 9 ? *refer to the front of the optocoupler section of the current catalog, under product safety regulations section, iec/en/din en 60747-5-2, for a detailed description. note: isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits i n application.
6 absolute maximum ratings (no derating required up to +85?c) parameter symbol min. max. units storage temperature t s ?5 125 ?c operating temperature t a ?0 85 ?c average forward input current i f(avg) 20 ma peak forward input current i f(peak) 40 ma (50% duty cycle, 1 ms pulse width) peak transient input current i f(tran) 1.0 a (< 1 s pulse width, 300 pps) reverse input voltage v r 5v input power dissipation p i 35 mw output current (pin 6) i o 60 ma emitter base reverse voltage (pin 5-7) v eb 0.5 v supply voltage and output voltage v cc ?.5 7 v output power dissipation p o 100 mw total power dissipation p t 135 mw lead solder temperature (for through hole devices) 260?c for 10 sec., 1.6 mm below seating plane. reflow temperature profile see package outline drawings section. (for soic-8 and option #300) recommended operating conditions parameter symbol min. max. units power supply voltage v cc 2.7 3.6 v forward input current (on) i f(on) 0.5 12.0 ma forward input voltage (off) v f(off) 00.8v operating temperature t a 070?c
7 electrical specifications 0?c t a +70?c, 2.7 v v cc 3.3 v, 0.5 ma i f(on) 12 ma, 0 v v f(off) 0.8 v, unless otherwise specified. all typicals at t a = 25?c. (see note 8.) device parameter sym. hcpl- min. typ.* max. units test conditions fig. note current transfer ctr 400 1300 5000 % i f = 0.5 ma v cc = 3.3 v 1, 2 2 ratio v o = 0.4 v logic low v ol 0.05 0.3 v i f = 1.6 ma, v cc = 3.3 v output voltage i o = 8 ma 0.05 0.4 v i f = 5.0 ma, i o = 15 ma logic high i oh 525 av o = v cc = 3.3 v i f = 0 ma 2 output current logic low i ccl 270l/070l 0.4 1.3 ma v cc = 3.3 v i f1 = i f2 = 1.6 ma supply current v o1 = v o2 = open 273l/073l 0.8 2.7 ma logic high i cch 270l/070l 0.002 1 av cc = 3.3 v i f1 = i f2 = 0 ma supply current v o1 = v o2 = open 273l/073l 0.002 2 a input forward v f 1.5 1.7 v t a = 25?c i f = 1.6 ma 3, 4 voltage input reverse bv r 5.0 v i r = 10 a, t a = 25?c 2 breakdown voltage input c in 60 pf f = 1 mhz, v f = 0 2 capacitance *all typical values at t a = 25?c and v cc = 3.3 v, unless otherwise noted.
8 switching specifications (ac) over recommended operating conditions (t a = 0?c to +70?c), v cc = 3.3 v, unless otherwise specified. (see note 8.) device parameter sym. hcpl- min. typ.* max. units test conditions fig. note propagation delay t phl 30 si f = 0.5 ma, rl = 4.7 k ? 52 time to logic low at output propagation delay t plh 90 si f = 0.5 ma, r l = 4.7 k ? 52 time to logic high at output common mode |cm h | 1000 10000 v/ si f = 0 ma, t a = 25?c, 6 2, 6, 7 transient immunity rl = 2.2 k ? at logic high |v cm | = 10 v p-p level output common mode |cm l | 1000 10000 v/ si f = 1.6 ma, t a = 25?c, 6 2, 6, 7 transient immunity rl = 2.2 k ? at logic low |v cm | = 10 v p-p level output *all typical values at t a = 25?c and v cc = 3.3 v, unless otherwise noted.
9 package characteristics parameter sym. device hcpl- min. typ.* max. units test conditions fig. note input-output v iso 3750 v rms rh 50%, 4, 9 momentary t = 1 min., withstand t a = 25?c voltage** resistance r i-o 10 12 ? v i-o = 500 vdc 4 (input-output) rh 45% capacitance c i-o 0.6 pf f = 1 mhz 11 (input-output) input-input i i-i 0.005 a rh 45% 5 insulation v i-i = 500 vdc leakage current input-input r i-i 10 11 ? 5 insulation leakage current capacitance c i-i 2730 0.03 pf 5 (input-input) 2731 0730 0.25 0731 *all typical values at t a = 25?c, unless otherwise noted. **the input-output momentary withstand voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. for the continuous voltage rating refer to the iec/en/din en 60747-5-2 insulation characteristics table (if app licable), your equipment level safety specification or agilent application note 1074 entitled "optocoupler input-output endurance voltage." notes: 1. pin 5 should be the most negative voltage at the detector side. 2. each channel. 3. dc current transfer ratio (ctr) is defined as the ratio of output collector current, i o , to the forward led input current, i f , times 100%. 4. device considered a two-terminal device: pins 1, 2, 3, and 4 shorted together, and pins 5, 6, 7, and 8 shorted together. 5. measured between pins 1 and 2 shorted together, and pins 3 and 4 shorted together. 6. common mode transient immunity in a logic high level is the maximum tolerable (positive) dv cm /dt of the common mode pulse, v cm , to assure that the output will remain in a logic high state (i.e., v o > 2.0 v). common mode transient immunity in a logic low level is the maximum tolerable (negative) dv cm /dt of the common mode pulse, v cm , to assure that the output will remain in a logic low state (i.e., v o < 0.8 v). 7. in applications where dv/dt may exceed 50,000 v/ s (such as static discharge) a series resistor, r cc , should be included to protect the detector ic from destructively high surge currents. the recommended value is r cc = 110 ? . 8. use of a 0.1 f bypass capacitor connected between pins 5 and 8 adjacent to the device is recommended. 9. in accordance with ul 1577, each optocoupler is proof tested by applying an insulation test voltage > 4500 v rms for 1 second (leakage detection current limit, i i-o < 5 a). 10. in accordance with ul 1577, each optocoupler is proof tested by applying an insulation test voltage > 6000 v rms for 1 secon d (leakage detection current limit, i i-o < 5 a). 11. measured between the led anode and cathode shorted together and pins 5 through 8 shorted together. 12. derate linearly above 65?c free-air temperature at a rate of 2.3 mw/?c for the so-8 package.
10 figure 1. current transfer ratio vs. forward current. figure 2. output current vs. input diode forward current. figure 3. input diode forward current vs. forward voltage. figure 4. forward voltage vs. temperature. 1.6 1.5 1.4 1.3 -60 -20 20 40 100 v f forward voltage v t a temperature c 60 80 0 -40 1.2 i f = 1.6 ma i f input diode forward current ma 0.01 0.01 0.1 10 i o output current ma 0.1 1.0 10 100 t a = 25 c t a = 0 c t a = 70 c t a = 85 c t a = -40 c 1 v f forward voltage v 100 10 0.1 0.01 1.1 1.2 1.3 1.4 i f forward current ma 1.6 1.5 1.0 0.001 1000 v f + t a = 25 c t a = 0 c i f t a = 85 c t a = 70 c t a = -40 c i f forward current ma 2000 1600 800 400 0.1 1.0 ctr current transfer ratio % 10 1200 0 v cc = 3.3 v v o = 0.4 v 85 c 70 c 25 c 70 c -40 c
11 figure 5. switching test circuit. figure 6. test circuit for transient immunity and typical waveforms. v o pulse gen. z = 50 ? t = 5 ns o r i monitor f i f 0.1 f l r c l = 15 pf* r m 0 t phl t plh o v i f ol v 50% 50% 3.3 v 3.3 v 7 1 2 3 4 5 6 8 10% duty cycle i/f < 100 s (saturated response) t f t r o v (non-saturated response) 3.3 v 90% 10% 90% 10% * includes probe and fixture capacitance v o i f l r a b pulse gen. v cm + v ff o v ol v o v 0 v 10% 90% 90% 10% switch at a: i = 0 ma f switch at b: i = 1.6 ma f cm v t r t f 3.3 v +3.3 v 7 1 2 3 4 5 6 8 r cc (see note 6) 10 v t r , t f = 16 ns
www.agilent.com/semiconductors for product information and a complete list of distributors, please go to our web site. for technical assistance call: americas/canada: +1 (800) 235-0312 or (916) 788-6763 europe: +49 (0) 6441 92460 china: 10800 650 0017 hong kong: (+65) 6756 2394 india, australia, new zealand: (+65) 6755 1939 japan: (+81 3) 3335-8152 (domestic/interna- tional), or 0120-61-1280 (domestic only) korea: (+65) 6755 1989 singapore, malaysia, vietnam, thailand, philippines, indonesia: (+65) 6755 2044 taiwan: (+65) 6755 1843 data subject to change. copyright ?2004 agilent technologies, inc. obsoletes 5989-0298en december 20, 2004 5989-2103en

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